Nano-engineered surfaces for ultra high power density thermal management

Rapid dissipation of heat

As electronics become denser and consume higher power they generate considerable heat. This heat must be removed rapidly for the devices to function properly. The goal of this project is to develop novel surface-technology-enabled systems that can dissipate extremely high amounts of heat very rapidly. This would remove a critical bottleneck for next generation products and allow the deployment of smaller, higher power electronics systems.