Handling assembly of ultra-thin silicon membranes
Project team Henry Smith and Paul Lozano with Ash Dyer, Dakota Freeman, Corey Fucetola, Jay Fucetola, Katherine Mirica, and Haydn Mitchell
Placing thin layers of semiconductors
3D integrated electronic components require the stacking of thin layers of semiconductors. Manufacturing of such devices is very difficult as the layers become thinner. This project is developing a novel approach to handling and placing these thin layers, which would allow the manufacture of a new class of components using very thin layers.