Handling Assembly of Ultra-thin Silicon Membranes

Henry Smith and Paul Lozano with Ash Dyer, Dakota Freeman, Corey Fucetola, Jay Fucetola, Katherine Mirica, and Haydn Mitchell

3D integrated electronic components require the stacking of thin layers of semiconductors. Manufacturing of such devices is very difficult as the layers become thinner. This project is developing a novel approach to handling and placing these thin layers, which would allow the manufacture of a new class of components using very thin layers.

See Corey present this project at IdeaStream 2017 below.